Liquid Flow Through Module
Next Level Cooling Solutions for Advanced MIL computing power
Although software is advancing rapidly, processors must remain the same size or shrink to meet SWaP requirements. As the upper threshold of board level heat and power dissipation continues to rise, it is exceeding the limits of air and conduction cooling, requiring more advanced solutions to keep boards from overheating.
nVent SCHROFF has developed a Liquid Flow Through cooling solution in accordance with VITA Standard 48.4 which will allow customers to solve their thermal challenges with a customized flow through path that transfers heat away from processors.
This provides superior heat dissipation compared to air or conduction cooling, with cooling capacity of approximately 300+ watts per 6U slot.
Thermal Design Expertise
- Over 20 years of expertise in liquid cooling
- Offer simulation and testing of module
- Can design and develop entire liquid flow through module
Meets Rugged Standard
- Meets REDI compliance
- Meets VITA 48.4 for:
○ Standard leak proof interconnect for coolant
○ Ruggedized Architecture
○ 300W cooling capacity for 6U board/modules - Built in nVent ITAR registered facility
Customization
- Can customize flow path, ambient temperature and board layout
- Ability to maximize thermal performance and develop specifications for 3U boards
- High degree of customization with low minimum quantities
Functional Overview
Technical Paper Download
Contact Us
To learn more about our Liquid Flow Through Cooling Module. Our specialists are here to help you find the perfect fit.
