Easy Swap LFT: Advancing Liquid Cooling Technology for High Density 3U Eurocard Systems

Rising power densities in embedded computing continue to challenge traditional thermal management. Modern processors, FPGAs, and high‑performance modules routinely exceed the cooling capabilities of forced‑air systems, especially in compact 3U Eurocard environments. To meet these demands, the Easy Swap LFT (Liquid Flow Through) platform introduces a new approach to liquid cooling that integrates seamlessly into existing 19” card‑cage infrastructures.

Easy Swap LFT delivers high thermal performance, mechanical compatibility, and modularity—enabling engineers to deploy liquid cooling without redesigning their chassis or altering established Eurocard architectures.

A Modular Liquid‑Cooling Platform for 3U Eurocard Designs

The Easy Swap LFT system consists of two primary elements:

• Easy Swap LFT Cold Plates
• Easy Swap LFT Cooling Circuitry (“Back‑Pack”)

Together, they provide a scalable cooling solution capable of removing 200 W or more per cold plate and approximately 600 W through the cooling circuitry, even at 50°C ambient temperature. Compared to forced‑air cooling, the system achieves more than a 30 K reduction in hotspot temperature, enabling significantly higher power budgets per board.

A key advantage is full compatibility with standard 19” card cages, allowing liquid cooling to be added to existing systems. Air‑cooled and liquid‑cooled boards can operate side‑by‑side in the same subrack, supporting hybrid thermal configurations.

Engineering the Cold Plate: Precision Cooling for 3U Boards

The Easy Swap LFT cold plates are engineered specifically for 3U Eurocard boards and are available in short and long versions to match different board layouts.

Technical Features

• Copper cold plate with milled liquid channels
  Ensures high thermal conductivity and efficient heat extraction.
• Stainless steel backside with integrated seal strip
  Provides long‑term leak protection and structural stability.
• Right‑angled copper hose connectors
  Allow hose routing below the card cage, preserving front‑side accessibility.
• Rubber Suspension Devices
  Compensate for mechanical tolerances and enable full surface thermal contact.

Factor Options

• Short version
  Fits behind the mezzanine of an 8 HP board.
• Long version
  Occupies the adjacent 4 HP slot next to a 4 HP card.

Both versions will be available in an unmanaged variant first. Managed models will be released soon and will include a temperature sensor and cable for system‑level monitoring and integration.

Cold Plate Delivery Includes

• LFT cold plate (copper / stainless steel)
• Two spring‑loaded mounting bars with suspension devices
• Copper fluid connectors
• Two hoses (700 mm each)
• Temperature sensor (managed version)

Cooling Circuitry: A Compact Rear‑Mounted Thermal Engine

The Easy Swap LFT cooling circuitry is designed as a 76 HP “back‑pack” module for the 3U rear card cage. This compact assembly integrates all components required for a closed‑loop liquid‑cooling system.

Integrated Components

• Radiator (240 × 120 mm)
  Transfers heat from the liquid to the surrounding air.
• Two low‑noise 12 V DC fans (< 45 dB)
  Suitable for industrial, telecom, and lab environments.
• 12 V DC pump
  Maintains stable liquid flow across up to three cold plates.
• Expansion tank with pressure equalization membrane
  Ensures long‑term reliability and compensates for thermal expansion.
• MicroFit connector for 12 V DC input (50 W max)

Cooling Performance

• Approx. 600 W cooling capacity
  Supports multi‑board high‑power systems.

There are two options to connect the Cold Plates to the Cooling circuitry

• Direct Connection Set (for one Cold Plate): Set of 2 threaded hose connectors and 2 Hose clamps. 
• Quick Disconnect Set (for one Cold Plate): Set of 2 Quick disconnect connectors and 2 Hose clamps. 

The quick disconnects allow quick replacements of Cold Plates without draining off the liquid

Why Easy Swap LFT Represents a Step Forward in Embedded Cooling

Retrofittable Liquid Cooling

The system integrates into existing 19” card cages without mechanical redesign.

Hybrid Cooling Support

Air‑cooled and liquid‑cooled boards can coexist in the same subrack.

High Power Density

Supports next‑generation processors, RF modules, and power electronics with 200 W+ per cold plate.

Clean Mechanical Integration

Hoses route between bottom rails, and vibration dampers protect sensitive components.

Serviceability

Quick disconnects and modular components simplify installation and maintenance.

Enabling the Next Generation of High‑Performance Embedded Systems

Easy Swap LFT introduces a modern, high‑efficiency liquid‑cooling solution tailored for 3U Eurocard environments. By combining strong thermal performance with mechanical compatibility and modular design, the platform enables engineers to increase power density, improve reliability, and extend system lifetime—without abandoning established 19” infrastructure.

This technology marks a significant advancement in embedded thermal management and provides a clear path forward for systems requiring higher performance in compact form factors.

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