Liquid Flow Through Module Whitepaper

Discover how nVent SCHROFF adopted the VITA 48.4 standard to engineer a liquid cooling solution—capable of managing thermal loads up to 300 W—without allowing liquid to come into direct contact with sensitive circuit boards.

As military technologies advance through artificial intelligence and electronic warfare, multicore processors are being pushed to operate at unprecedented speeds. Yet, stringent Size, Weight, and Power (SWaP) constraints in vehicles and aircraft limit design flexibility, rendering traditional cooling methods ineffective. To address this challenge, nVent SCHROFF applied over 20 years of liquid cooling expertise and adopted the VITA 48.4 standard to develop a liquid flow-through module. This innovative solution significantly improves heat dissipation while integrating seamlessly into existing infrastructure—eliminating the need for major redesigns.