Home

The 4U LHX delivers up to 7.5 kW of cooling capacity in a space-saving 4U design, enabling higher rack densities without compromising reliability. Designed for easy integration into standard 19" cabinets, it combines efficient thermal management, intelligent monitoring, and retrofit-friendly deployment to help keep high-performance electronics operating at their best.

Smart DCDU provides intelligently managed -48V DC power for mission-critical communications. With real-time monitoring, remote access, and preventive maintenance features, it helps reduce downtime, improve operational efficiency, and keep essential infrastructure running securely and reliably.

The Easy Swap Liquid Flow-Through (LFT) is designed to bring high-performance liquid cooling into standard 3U Eurocard environments—without compromising modularity. Built for engineers working with high-density electronics, it delivers precise thermal control where forced air reaches its limits.

As computing power increases and conventional cooling methods reach their limits, a breakthrough is available. nVent SCHROFF's Liquid Flow Through Module offers a state-of-the-art solution that redefines thermal management for challenging environments. Engineered for demanding SWaP needs with superior heat dissipation, customizable design, and VITA 48.4 compliance.

When it comes to building these quantum computing control systems, it’s human nature to start with what you know. However, many engineers end up reinventing the wheel, often without credence for existing platforms that could serve as a strong design foundation. 

The digitization of railway systems requires safeguarding critical digital infrastructure against cyber threats and physical interference. Protecting trackside electronics is crucial, with innovations like nVent SCHROFF’s enclosures ensuring system integrity. 

For an electronics system to be effective in a given combat domain, its packaging (the physical housing, thermal management, and method of installation) must meet rigorous design requirements.

Achieve 128 Gbits bandwidth per slot with PCIe Gen 5. Enjoy enhanced rear card cage cooling and a future-proof design with the new nVent SCHROFF cooling unit Manager, which implements the long-lasting STM32 controller. Mix and match legacy and new chassis and cooling units seamlessly.

nVent SCHROFF will be exhibiting at IEEE Quantum Week 2026, the IEEE International Conference on Quantum Computing and Engineering (QCE), taking place 13–18 September 2026 at the Metro Toronto Convention Centre

Meet us during 22-25 September at InnoTrans 2026 in Hall 4.1, booth 540, and discover how we design and materialize systems integrity for onboard, trackside, and technical room applications. On display will be integrated and railway compliant cabinets with subracks, embedded systems that include backplanes, power, and cooling. Let's talk resilient systems design soon!

nVent SCHROFF will participate in DefenceTec 2026 | Augsburg, Germany | 20–22 October 2026, the international B2B and B2G event focused on defence and security technologies for air, space, and digital systems.

Join us on November 10 - 13, 2026, at Electronica in Munich, Germany, booth B3 - 343. Visit our booth to explore how our advanced infrastructure solutions support high-performance electronics and help accelerate innovation across today’s most demanding applications.