CassettePRO with extra cooling capacities
Test and measurement application that needs additional heat dissipation of a hot spot of one bord via FHC to the side panel.
Solutions:
- Cool the hot spot of the PCB inside the cassette.
- Use the side panels with cooling fins. Use the FHC to guide the heat from the hot spot of the PCB through the FHC and the side panel.
- Reduction of the processor surface temperature by approx. -10 to 12°C.
