Easy Swap LFT for 3U Eurocard Systems
Engineered Cooling for Next-Generation Modular Systems
The Easy Swap Liquid Flow-Through (LFT) is designed to bring high-performance liquid cooling into standard 3U Eurocard environments—without compromising modularity. Built for engineers working with high-density electronics, it delivers precise thermal control where forced air reaches its limits.
Supporting one to three cold plates within an integrated cooling circuit, the system enables heat dissipation of over 200 W per cold plate and more than 600 W per system, even at ambient temperatures up to 50°C. This results in hotspot temperature reductions of over 30 K, improving system stability, performance, and component lifespan.
Designed for seamless integration into standard 19" card cages, the Easy Swap LFT requires no redesign of existing board architectures or backplanes. Clean hose routing within the subrack ensures a compact setup, while the closed-loop design supports reliable, location-independent operation.
The solution also enables hybrid cooling architectures—combining liquid cooling for high-power slots with air cooling for the remaining modules—giving engineers the flexibility to scale thermal performance while preserving system compatibility.
KEY FEATURES
Cold plate Installation
The cold plate is installed in the adjacent slot of the target board and secured using two mounting bars attached to the top and bottom rails of the card cage, with screws accessible from the outside. A specially designed thermal gap pad ensures full surface contact between the board heat sink and the cold plate, optimizing heat transfer, while the heat sink itself is angled by 2° to precisely match the cold plate surface. Rubber vibration dampers provide a floating mount, compensating for mechanical tolerances and ensuring stable, reliable integration.
Cooling Circuitry Design
The backpack module is designed to integrate into a 3U rear card cage, occupying 76 HP while allowing space for an 8 HP AC inlet alongside the cooling infrastructure. It incorporates a complete liquid-to-air cooling system, including a heat transfer coil, pump, expansion tank with pressure equalization membrane, and quick-disconnect interfaces for up to three cold plates. Two low-noise fans, operating at approximately 45 dB, ensure efficient airflow while maintaining room-level acoustics. Together, these components deliver a total cooling capacity of around 600 W, providing a compact and self-contained thermal management solution for high-density systems.
BENEFITS
Easy Retrofit Integration
Upgrade existing 19" modular systems without redesigning boards or backplanes. Requires only a dedicated heat sink interface and supports standard Eurocard board formats.
High-Density Cooling Power
Handles demanding thermal loads with up to ~200 W per cold plate and ~600 W per system, with a scalable design for future performance needs.
Continuous Operation
Swap boards and perform maintenance without disconnecting the cooling loop—keeping systems running and reducing service interruptions.
Leak-Safe System Stability
Minimizes risk of coolant leaks and air ingress while ensuring consistent cooling performance for reliable, long-term operation.
COLD PLATE DESIGN FEATURES
Available in short and long variants, unmanaged configurations. Includes a copper and stainless‑steel cold plate, mounting bars with integrated tolerance elimination devices, copper hose connectors, and coolant hoses. Future managed versions will also feature an integrated temperature sensor for enhanced monitoring. To connect the cold plate to the cooling circuit, a direct connection set and a quick disconnect set are available
High-performance copper cold plate with milled liquid channels for efficient cooling. Features leak-proof sealing, soldered hose connectors with right-angled routing for space optimization. Integrated tolerance elimination devices ensure stability. The short version is designed for 8 HP boards with front mezzanine card and fits into the space behind the mezzanine. The long version is optimized for boards with full-surface heat sinks and is placed into the adjacent 4 HP slot.
Customers can download the step file for the heat sink geometries that are required to make a full-surface contact between the board heat sink and the Easy Swap LFT Cold Plate. Or they can send us the 3D model of their boards with specified hot spots that we create the heat sink for them.
LIQUID COOLING FOR MODULAR SYSTEMS, SIMPLIFIED
PRODUCT OFFERING
COOLING CIRCUITRY
Delivery comprises:
- Backpack for 3U rear card cage, 76 HP
- Radiator (240 x 120 mm)
- 2x 12V DC low noise fans (< 45 dB)
- 1x 12V DC Pump
- Expansion tank + pressure equalization membrane
- Connection joints for 3 cold plates (quick disconnects)
- Microfit connector for 12 V DC input (50W max. power)
RESOURCES
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